键合引线,Bonding Wire
1)Bonding Wire键合引线
2)wire bonding引线键合
1.Studies on the Characteristic of Ultrasonic Complex Transverse Vibration Energy Transmission in Wire Bonding;引线键合中多向超声能量传输特性研究
2.Automaticwire bonding system for MEMS sensor packaging;MEMS器件自动引线键合系统
3.A novel instrument of silicon chip thermocompression outerwire bonding and jointing process research;硅芯片外引线键合的热压焊装置及焊接工艺
英文短句/例句
1.Research on the Factors Affecting the First Bond of Ultra-Fine Pitch Wire Bonding Process;超细间距引线键合第一键合点影响因素研究
2.Research of Ultrasonic Power Supply in Wire Bonding Based on FPGA基于FPGA的引线键合超声电源的研究
3.Design of High-frequency Ultrasonic Transducer for Wire Bonding and Research on Motion Control of Bond Head引线键合高频超声换能器的设计和键合头运动控制研究
4.Research on Micro Vision System for Automatic MEMS Wire Bonding;面向MEMS自动引线键合的显微视觉系统研究
5.The Research of the Image Recognition System for Intelligent IC Wire Bonder;智能IC引线键合机图像识别系统的研究
6.Research of Methods for Bonds Inspection of Automatic Wire Bonder;全自动引线键合机产品检测方法的研究
7.Software Analysis and Design of the Fully Automatic Gold Wire Bonder全自动引线键合机系统软件分析与设计
8.Investigation of Factors Affecting Bonded Ball Hardness on Copper Wire Bonding铜引线键合中影响焊球硬度因素的研究(英文)
9.Effect of Substrate Surface Smoothness on Thin Al Wire Wedge Bonding Strength平整度对细Al丝超声引线键合强度的影响
10.Implementation and Reliability of Wire-Bonding for 3-D Packages三维封装中引线键合技术的实现与可靠性
11.Simulation and Study of Ultrasonic Vibration Propagation in Wire Bonding System超声振动在引线键合系统中的传播仿真与研究
12.Application of Novel Image Matching Algorithm in Golden Wire Bonder新图像匹配算法在金丝球引线键合机中的应用
13.Effect Factors Analysis of Wire Bonding Quality on Microwave Circuit微波电路引线键合质量的影响因素分析
14.Analysis of Impact Factors on the Bonding Quality of Gold Ball Bonding Process;面向引线键合工艺的质量影响因素与规律的分析
15.Vision-Based Kinematic Calibration of the X-Y Table for a Wire Bonder基于计算机视觉的引线键合机定位平台的运动学标定
16.The Design of Holding Feed Mechanism of the Die Bonder键合机引线框架夹持传送机构的设计与开发
17.Clutch Coil Lead Wire Harness离合器线圈引导线束
18.identification in hybrids混合微电路引线辨识
相关短句/例句
wire bonding引线键合
1.Studies on the Characteristic of Ultrasonic Complex Transverse Vibration Energy Transmission in Wire Bonding;引线键合中多向超声能量传输特性研究
2.Automaticwire bonding system for MEMS sensor packaging;MEMS器件自动引线键合系统
3.A novel instrument of silicon chip thermocompression outerwire bonding and jointing process research;硅芯片外引线键合的热压焊装置及焊接工艺
3)IC wirebondingIC引线键合
4)Wire Bonder引线键合机
1.The Calibration System Design ofWire Bonder;全自动引线键合机校正系统设计与实现
2.The Research of the Image Recognition System for Intelligent ICWire Bonder;智能IC引线键合机图像识别系统的研究
5)ribbon wire bonding引线带键合
1.Theribbon wire bonding procedure, different wire break off modes, wire specifications and the choosing method of wedge tool are discussed in considerable detail in the article.对于高频器件应用来说,引线带键合较之于圆形引线键合更为有利。
6)ultrasonic wire bonding超声引线键合
1.A PZT driver signal acquisition and analysis system forultrasonic wire bonding;超声引线键合PZT驱动信号采集分析系统
2.Ultrasonic transducer system is the most important part of the bonding machine,understanding theultrasonic wire bonding process is helpful.通过实验,观察分析了超声引线键合过程中不同劈刀安装长度对换能系统电流、电压及功率的影响,发现电流及功率在不同劈刀安装长度时有较为明显的变化。
3.Inultrasonic wire bonding process,the bonding pressure is one of the most important factors to the bonding strength.在超声引线键合过程中,键合力是影响键合强度的重要因素之一。
延伸阅读
UG自定义右键弹出菜单和快捷键UG的右键弹出菜单包含了一些我们常用的功能，比如Roate、Fit等，为了使用的更加方便，我们也可以自己打造！打开UG安装目录下的UGII下的menus文件夹，里面包含了一些*.men和*.tbr，我们以文本方式打开它，发现也不难理解。例如，我们想在右键弹出菜单里面的roate和pan之间加入如图示的view下的orient功能，首先我们打开ug_main.men,查找orient，会看到下面的 BUTTON UG_VIEW_REFRESHLABEL &RefreshBITMAP refresh_window.bmpACCELERATOR F5ACTIONS STANDARDCASCADE_BUTTON UG_VIEW_EDITLABEL O&perationBUTTON UG_VIEW_ORIENTLABEL Ori&ent...ACTIONS STANDARD参考上面部分我们会看出快捷键的定义是*ACCELERATOR来指定的，我们把红色部分即BUTTON UG_VIEW_ORIENT的LABEL下面加入一行ACCELERATOR Ctrl+Alt+O(这里可以自行定义，但不要和别的重复)，保存，这样我们就把快捷键定义好了，然后我们选中红色部分复制。接着打开ug_view_popup.men，它就是右键弹出菜单的定义文件。为了把它放在roate和pan之间，我们把刚才复制的部分粘贴在下面图示的位置：TOGGLE_BUTTON UG_VIEW_POPUP_ROTATELABEL R&otateBITMAP rotate.bmpACCELERATOR F7ACTIONS STANDARDBUTTON UG_VIEW_ORIENTLABEL Ori&ent...ACCELERATOR Ctrl+Alt+OACTIONS STANDARDTOGGLE_BUTTON UG_VIEW_POPUP_PANLABEL &Pan BITMAP pan.bmpACCELERATOR F9ACTIONS STANDARD
