界面结合力,interfacial binding force
1)interfacial binding force界面结合力
1.Theinterfacial binding forces among the plant fibers and the basalt fibers were theoretically explained to be the binding forces of the hydrogen bonds between the molecules of fibers, the hydrogen bonds between the molecules of agents and fibers as well as the meshwork binding forces of agent"s macromolecules am.植物纤维与玄武岩纤维之间的界面结合力为纤维之间的氢键结合力、纤维与助剂分子之间的氢键结合力、助剂大分子在纤维之间的"网络连接"作用力等。
2.The type ofinterfacial binding force was discussed in this paper, and formation process of bonding strength during wood gluing operation was also discussed.简要概述了界面结合力的类型以及木材胶接操作过程中胶合强度的形成过程。
英文短句/例句
1.Study on Bonding Strength between Film and Substrate Using Substrate Stretching Test;基体拉伸法测试膜基界面结合力的研究
2.The calculation and analysis by slip-line field for interfacial adhesion of electrodeposited nickel coating涂层界面结合力的滑移线场的计算与分析
3.Boundary element method for stress analysis of tungsten carbide insert interface on cone bit牙轮钻头镶齿结合面应力分析的边界元法
4.Molecular Dynamics Simulations of the Interfacial Structures in ZrB_2/SiC Composite;ZrB_2/SiC复合材料界面结构的分子动力学模拟
5.Microstructure and Mechanical Property of the Anodic Bonding Interface between Solid Electrolyte Glass (Ceramics) and Metals;玻璃（陶瓷）与金属阳极键合界面结构及力学性能
6.Modeling and Analysis of Interlaminar Stress of Stiffened Structures of Composites复合材料加筋结构界面层间应力分析建模
7.EXPERIMENTAL STUDY ON BOND BEHAVIOR OF INTERFACE BETWEEN OLD AND NEW CONCRETE COMPOSITE BEAM UNDER PRE-STRESSING FORCES预应力混凝土组合梁界面粘结的试验研究
8.DETERMINATION OF DYNAMIC INTERFACIAL TENSION BY COMPUTER-AIDED PENDANT DROP DIGITIZATION --EFFECT OF SURFACTANT CONCENTRATION ON DIT结合图像数字化技术用悬滴法测动态界面张力——动态界面张力与表面活性剂浓度的关系
9.Surface Bioactivation of Porous Titanium with Biomechanical Compatibility and the Bonding with Bone;生物力学相容多孔钛的表面活化及与骨界面结合研究
10.Influence of electric field on microstructure and mechanical properties of the diffusion joining interface of the AZ31B/Al joint电场对AZ31B/Al扩散结合界面结构及力学性能的影响
11.The effect of interface combination on the mechanical behavior of whisker-reinforced resin matrix composite界面结合状态对晶须树脂基复合材料力学行为的影响
12.Study of the TA1/Q235 clad plate"s interface structure and bonding characteristicsTA1/Q235钢复合板界面结构与结合特性
13.Investigation on the Mechanism and Microstructure and Mechanical Properties of the Anodic Bonding for the Pyrex Glass to Metals;Pyrex玻璃与金属阳极键合机理及界面结构和力学性能的分析
14.The Micromechanical Analysis for Fiber Reinforced Metal Matrix Composites with Weak Interfacial Bonding;弱界面粘结的纤维增强金属基复合材料细观力学分析
15.Analysis on the Interface Structure and Finite Element Simulation of the Anodic Bonding for the Pyrex Glass to Aluminum;Pyrex玻璃与铝阳极键合界面结构及残余应力模拟分析
16.Molecular Dynamics Simulation of Interfacial Self-Assembly Structure of the Carbon Fiber Composites炭纤维复合材料界面自组装结构的分子动力学模拟
17.INTERFACIAL STRUCTURE AND MECHANICAL PROPERTIES OF ALUMINIUM FOAM JOINTS FLUXLESS-SOLDERED WITH Zn-Al-Cu BASE ALLOYZn-Al-Cu基合金无钎剂钎焊泡沫铝的界面结构及力学性能
18.The Interface Structure of PA66/SiO_2 Nanocomposites and Its Effect on Mechanical Properties尼龙66/SiO_2纳米复合材料的界面结构及其对材料力学性能的影响
相关短句/例句
Interface adhesive strength界面结合能力
3)phase interface bonding strength相界面结合力
4)interfacial bonding界面结合
1.The reason is believed to be the improvedinterfacial bonding.研究表明，在碳化硅复合材料表面化学镀一层镍，能够较好地改善增强体与基体的界面结合，使得碳化硅复合材料的抗弯强度、冲击韧性及宏观硬度均有了明显的提高。
2.The fracture surface of the wires studied by scanning electron microscopy (SEM) shows a suitableinterfacial bonding between the fiber and aluminum.复合丝拉伸断口的扫描电镜（ＳＥＭ） 观察可见断面有一定起伏，部分纤维拔出但长度较短，表明纤维与基体具有适当的界面结合。
3.Al/Diamond composites were fabricated by Spark Plasma Sintering(SPS) under Solid-phase sintering,changes ofinterfacial bonding during sintering process were investigated mainly.使用放电等离子烧结(SPS)固相烧结条件下制备Al/Diamond复合材料,重点研究烧结过程中基体与增强体两相界面结合状态随烧结时间的变化规律。
5)interface[英]["?nt?fe?s][美]["?nt?"fes]结合界面
1.Theinterface between Ga_(95.15Sn合金与Cu基体的结合界面进行了分析。
6)bonding interface结合界面
1.Bonding ability of TA2 and 316L plates with explosion cladding was evaluated,the microstructure and composition of thebonding interface was investigated by SEM,EDS and XRD.结果表明,结合区形貌呈波状,结合界面附近形成细晶区;结合区存在不连续的熔合层,该层含有大量金属基体小碎块和合金化后生成的金属间化合物,并产生了裂纹、气孔,且波状结合界面不同位置组织成分分布不均匀等焊接缺陷;两基板之间发生了元素扩散;拉剪实验各项性能满足复合材料使用要求,拉伸后波状界面发生了分离。
2.(1)We have found and defined three kinds ofbonding interfaces:big wavy,small wavy and micro wavy,and the micro wavy interface is the best,in a cladding plate,it is for the first time to find that the form of interface presents regular distribution.爆炸焊接理论与技术取得了四个方面的进展:(1)发现并重新定义了三种结合界面:大波状、小波状和微波状,其中以微波状为最佳。
3.Thebonding interface of TA1/Q235 and the diffusion of Ti and Fe are investigated by the manufacture of TA1/Q235 with ARB process.通过TA1/Q235的累积叠轧焊,研究TA1/Q235复合板结合界面组织和Ti与Fe两元素的扩散情况。
延伸阅读
镀层结合力分子式：CAS号：性质：电镀层与基体表面的结合强度。评定的方法有摩擦抛光试验、剥离试验、锉刀试验、凿子试验、划线划格试验、弯曲试验、缠绕试验、拉力试验、阴极试验、喷丸试验等。定量测定的方法比较复杂，故常采用定性评定方法。
